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IEEE Defect and Data-Driven Testing
(D3T 2010)

November 4-5, 2010
Austin, TX, USA

http://d3t.tttc-events.org/

Submission Deadline Extended to September 3rd, 2010!
CALL FOR PAPERS
Scope -- Submissions -- Key Dates -- Committees

Scope

As technology scales, various new types of defects are presenting unique challenges to the test community. New test defect and data based methodologies are required to detect, monitor, and comprehend the various defect mechanisms at sub-50nm technology nodes and their impact on product quality and in-field reliability. Defect and data-driven testing (D3T) has been in practice for a number of years and often used for yield learning and analysis. It is now gaining attention more than ever in production test. D3T uses data to reduce defect levels, increase reliability, and to diagnose and solve yield problems. D3T can provide the basis for Adaptive Test decisions on which test conditions, tests, or test subsets to add/remove. It can be utilized for improving the overall quality of test by the use of outlier analysis. However, how to implement and analyze test and defect data in making these decisions is not a widely understood or utilized process in the industry. Closing the gap on knowledge of the process, new test techniques, and how defect models are being used to adapt test flows will be the goals of this year’s D3T workshop.

Paper presentations on topics related to the topics listed below are expected to generate active discussion on the challenges that must be met to ensure high IC quality through the end of the decade.

  • Outlier Identification
  • Data-Driven Testing (DDT)
  • Test Data Analysis
  • Yield Learning and Analysis Using DDT
  • Adaptive Test
  • Data-Mining Methods for Test Data Processing
  • Low Voltage Testing
  • Elevated Voltage Testing and Stress Testing
  • Reliability and Yield
  • Nanometer Test Challenges
  • Defect Coverage & Metrics
  • Mixed Current/Voltage Testing
  • Economics of Defect Based Testing
  • Fault Localization & Diagnosis
  • Noise and Crosstalk Testing
  • Transition and Delay Fault Testing

Submissions

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To present at the workshop, submit a postscript or Acrobat (PDF) version of an extended abstract of at least 1000 words via e-mail to the Program Chair by September 3, 2010. Each submission should include full name and address of each author, affiliation, telephone number, fax and e-mail address. The presenter should also be identified. Camera-ready papers for inclusion in the digest of papers will be due on Sept. 26, 2010. Presentations on cutting edge test technology, innovative test ideas, and industrial practices and experience are welcome. Proposals for embedded tutorials, debates, panel discussions or “spot-light” presentations describing industrial experiences are also invited.

Technical Program Submissions:
Sankaran Menon
Intel

E-mail: Sankaran.Menon@intel.com

Key Dates

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Submission deadline: September 3, 2010
Notification of acceptance: September 16, 2010
Final copy deadline: September 26, 2010

Committees
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Organizing Committee

General Chair
Al Crouch, Asset-Intertech

Program Chair
Sankaran M. Menon, Intel

Co-Program Chair
Jeff Roehr, Mediatek

Vice Program Chair
Nisar Ahmed, TI

Finance Chair
Sankaran M. Menon, Intel

Publicity Chair
Arani Sinha, AMD

Publication Chair
Chintan Patel, UMBC

Steering Committee

Sankaran Menon, Intel
Adit Singh, Auburn Univ.
M. Tehranipoor, U Connecticut
Hank Walker, Texas A&M
Hans Manhaeve, Q-Start Test
Jim Plusquellic, U. New Mexico

Program Committee

Rob Aitken, ARM
Tom Bartenstein, Cadence
Nemat Bidokhti, Cisco
Ken Butler, TI
Krish Chakrabarty, Duke Univ.
Sreejit Chakravarty, LSI Logic
John Carulli, TI
Bruce Cory, Nvidia
Jennifer Dworak, Brown University
Patrick Girard, LIRRM
Sandeep Goel, TSMC
Rohit Kapur, Synopsys
Ajay Koche, Consultant
Mike Laisne, Qualcomm
Nilanjan Mukherjee, Mentor Graphics
Teresa McLaurin, ARM
Amit Nahar, TI
Suriyaprakash Natarajan, Intel  
Jay Orbon, Verigy
John Potter, Asset-Intertech
Rajesh Raina, Freescale
Mani Soma, U Washington
Claude Thibeault, Ecole Tech
Li C. Wang, UCSB              
Xiaoqing Wen, Kyushu Institute of Tech.
LeRoy Winemberg, Freescale
Qiang Xu, CUHK

Mahmut Yilmaz, AMD

For more information, visit us on the web at: http://d3t.tttc-events.org/

The IEEE Defect and Data-Driven Testing (D3T 2010) is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) Computer Society's Test Technology Technical Council (TTTC).


IEEE Computer Society- Test Technology Technical Council

TTTC CHAIR
Adit D. SINGH
Auburn University - USA
Tel. +1-334-844-1847
E-mail adsingh@eng.auburn.edu

PAST CHAIR
André IVANOV
University of British Columbia - Canada
Tel. +1-604-822-6936
E-mail ivanov@ece.ubc.ca

TTTC 1ST VICE CHAIR
Michael NICOLAIDIS
TIMA Laboratory - France
Tel. +33-4-765-74696
E-mail michael.nicolaidis@imag.fr

SECRETARY
Christian LANDRAULT
LIRMM - France
Tel. +33-4-674-18524
E-mail landrault@lirmm.fr

ITC GENERAL CHAIR
Gordon W. ROBERTS
McGill University
- Canada
Tel. +1-514-398-6029
E-mail gordon.roberts@mcgill.ca

TEST WEEK COORDINATOR
Yervant ZORIAN
Virage Logic Corporation - USA
Tel. +1-510-360-8035
E-mail yervant.zorian@viragelogic.com

TUTORIALS AND EDUCATION
Dimitris GIZOPOULOS

University of Piraeus
- Greece
Tel. +30-210-414-2372
E-mail dgizop@unipi.gr

STANDARDS
Rohit KAPUR

Synopsys
, Inc. - USA
Tel. +1-650-934-1487
E-mail rkapur@synopsys.com

EUROPE
Zebo PENG
Linköping University - Sweden
Tel. +46-13-282-067/-281-000
E-mail zpe@ida.liu.se

MIDDLE EAST & AFRICA
Ibrahim HAJJ
American University of Beirut - Lebanon
Tel. +961-1-341-952
E-mail ihajj@aub.edu.lb

STANDING COMMITTEES
André IVANOV
University of British Columbia - Canada
Tel. +1-604-822-6936
E-mail ivanov@ece.ubc.ca

ELECTRONIC MEDIA
Alfredo BENSO
Politecnico di Torino - Italy
Tel. +39-011-564-7080
E-mail alfredo.benso@polito.it

 

PRESIDENT OF BOARD
Yervant ZORIAN
Virage Logic Corporation- USA
Tel. +1-510-360-8035
E-mail yervant.zorian@viragelogic.com

SENIOR PAST CHAIR
Paolo PRINETTO
Politecnico di Torino - Italy
Tel. +39-011-564-7007
E-mail Paolo.Prinetto@polito.it

TTTC 2ND VICE CHAIR
Chen-Huan CHIANG

Alcatel-Lucent
- USA
Tel. +1-973-386-6759
E-mail chenhuan@alcatel-lucent.com

FINANCE
Michael NICOLAIDIS
TIMA Laboratory - France
Tel. +33-4-765-74696
E-mail michael.nicolaidis@imag.fr

IEEE DESIGN & TEST EIC
K.T. (Tim) CHENG
University of California, Santa Barbara - USA
Tel. +1-805-893-72942
E-mail timcheng@ece.ucsb.edu

TECHNICAL MEETINGS
Chen-Huan CHIANG
Alcatel-Lucent
- USA
Tel. +1-973-386-6759
E-mail chenhuan@alcatel-lucent.com

TECHNICAL ACTIVITIES
Matteo SONZA REORDA
Politecnico di Torino - Italy
Tel.+39-011-564-7055
E-mail matteo.sonzareorda@polito.it

ASIA & PACIFIC
Kazumi HATAYAMA
STARC - Japan
Tel. +
E-mail hatayama.kazumi@starc.or.jp

LATIN AMERICA
Victor Hugo CHAMPAC
Instituto Nacional de Astrofisica - Mexico
Tel.+52-22-470-517
E-mail champac@inaoep.mx

NORTH AMERICA
William R. MANN
SW Test Workshop - USA
Tel. +1-949-645-3294
E-mail william.mann@ieee.org

COMMUNICATIONS
Cecilia METRA
Università di Bologna - Italy
Tel. +39-051-209-3038
E-mail cmetra@deis.unibo.it

INDUSTRY ADVISORY BOARD
Yervant ZORIAN
Virage Logic Corporation- USA
Tel. +1-510-360-8035
E-mail yervant.zorian@viragelogic.com


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